π Local Job Near You
Photonic Process Engineer: Wire Bonding & Die Attach
Ciena Corporation
π
ottawa, Canada
Location
ottawa
Posted
June 01, 2026
Commute
Local Area
Local Opportunity Near You!
This job is in your area. Enjoy a short commute and work close to home.
Job Description
A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelorβs degree in mechanical engineering and 2β3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Competitive salary range of $71,600 to $114,400 and comprehensive benefits offered.
#J-18808-Ljbffr
#J-18808-Ljbffr