Rapid development of high-performance computing and artificial intelligence drives the demand for advanced semiconductor packaging, enabling diverse components to be integrated into the device to achieve high performance and efficiency. Plating innovations are needed to participate in the technology inflections for Advanced Packaging, including high-speed plating, scaling for high-density modules, and additive control to enable low-temperature hybrid bonding.

We are seeking a detail-oriented and safety-conscious Chemical Technician to support our electroplating operations. The successful candidate will be responsible for preparing and maintaining chemical baths, operating plating equipment, monitoring process parameters, and ensuring compliance with quality and safety standards.

• Assist Chemists/Engineers in the design of experiments (e.g. experiments in the wet chemical lab and metal plating).

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